Applied Materials expands AI chip packaging work with Besi at new Silicon Valley centre
The companies will widen joint development from hybrid bonding to next-generation interconnects and panel-level integration.
Applied Materials said on Friday it will join as an innovation partner at the Equipment and Process Innovation and Commercialization (EPIC) Center that Besi is building in Silicon Valley, Chosun Biz reported.
The two companies have jointly developed hybrid bonding technology since 2020. They now plan to broaden their work to next-generation die-to-wafer hybrid bonding platforms, thermal compression bonding, die-on-wafer, die-on-die and die-on-panel integration, and photonics interconnects for co-packaged optics.
Hybrid bonding connects chips by directly joining copper interconnects and dielectric layers instead of using conventional bumps, allowing higher data transfer speeds and density. It is seen as a key technology for AI accelerators packaged with high-bandwidth memory.
For West Coast chip designers, the work adds to advanced-packaging capacity being built close to home in Silicon Valley.
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